Advanced Materials for Thermal Management of Electronic Packaging
by
 
Tong, Xingcun Colin. author.

Title
: 
Advanced Materials for Thermal Management of Electronic Packaging

Author
: 
Tong, Xingcun Colin. author.

ISBN
: 
9781441977595

Physical Description
: 
XXII, 618 p. online resource.

Series
: 
Springer Series in Advanced Microelectronics, 30

Series Title
: 
Springer Series in Advanced Microelectronics, 1437-0387 ; 30

Subject Term
: 
Physics.
 
Engineering.
 
Electronics.
 
Optical materials.

Added Corporate Author
: 
SpringerLink (Online service)

Electronic Access
: 
http://dx.doi.org/10.1007/978-1-4419-7759-5


LibraryMaterial TypeItem BarcodeShelf Number[[missing key: search.ChildField.HOLDING]]Status
Online LibraryE-Book172970-2001ONLINEElektronik Kütüphane