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1. 
Cover image for Encapsulation technologies for electronic applications
Encapsulation technologies for electronic applications
Author 
Ardebili, Haleh. Pecht, Michael G.
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ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780815515760
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2. 
Cover image for Risk-Based Engineering An Integrated Approach to Complex Systems—Special Reference to Nuclear Plants
Risk-Based Engineering An Integrated Approach to Complex Systems—Special Reference to Nuclear Plants
Author 
Varde, Prabhakar V. author. Pecht, Michael G. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-13-0090-5
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3. 
Cover image for Optimum Cooling of Data Centers Application of Risk Assessment and Mitigation Techniques
Optimum Cooling of Data Centers Application of Risk Assessment and Mitigation Techniques
Author 
Dai, Jun. author. Ohadi, Michael M. author. Das, Diganta. author. Pecht, Michael G. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-5602-5
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4. 
Cover image for Copper Wire Bonding
Copper Wire Bonding
Author 
Chauhan, Preeti S. author. Choubey, Anupam. author. Zhong, ZhaoWei. author. Pecht, Michael G. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-5761-9
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