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1. 
Cover image for Biomaterials science processing, properties and applications IV
Biomaterials science processing, properties and applications IV
Author 
Bose, Susmita. Bandyopadhyay, Amit. Narayan, Roger.
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ONLINE(342113.1)
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John Wiley http://dx.doi.org/10.1002/9781118995235
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2. 
Cover image for Biomaterials science. II processing, properties and applications
Biomaterials science. II processing, properties and applications
Author 
Narayan, Roger. Bose, Susmita. Bandyopadhyay, Amit. Materials Science & Technology Conference (9th : 2011 : Columbus, Ohio)
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John Wiley http://dx.doi.org/10.1002/9781118511466
ebrary http://site.ebrary.com/id/10627206
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3. 
Cover image for Medical device materials IV proceedings of the Materials & Processes for Medical Devices Conference 2007, September 23-27, 2007, Palm Desert, California, USA
Medical device materials IV proceedings of the Materials & Processes for Medical Devices Conference 2007, September 23-27, 2007, Palm Desert, California, USA
Author 
Materials & Processes for Medical Devices Conference (4th : 2007 : Palm Desert, Calif.) Gilbert, Jeremy.
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ONLINE(312867.1)
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Knovel http://app.knovel.com/web/toc.v/cid:kpMDMIVPM1
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4. 
Cover image for Medical device materials III proceedings from the Materials & Processes for Medical Devices Conference 2005, November 14-16, 2005, Boston, Massachusetts, USA
Medical device materials III proceedings from the Materials & Processes for Medical Devices Conference 2005, November 14-16, 2005, Boston, Massachusetts, USA
Author 
Materials & Processes for Medical Devices Conference (3rd : 2005 : Boston, Mass.) Venugopalan, Ramakrishna. Wu, Ming Hsiung.
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ONLINE(312868.1)
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Knovel http://app.knovel.com/web/toc.v/cid:kpMDMIIIP2
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5. 
Cover image for Materials for medical engineering
Materials for medical engineering
Author 
European Conference on Advanced Materials and Processes (6th : 1999 : Munich, Germany) Stallforth, H. Revell, Peter A. (Peter Allen), 1943- Deutsche Gesellschaft für Materialkunde. Federation of European Materials Societies.
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ONLINE
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John Wiley http://dx.doi.org/10.1002/3527606149
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