Bonding in Microsystem Technology

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Title:

Author:

Dziuban, Jan A. author.

ISBN:

9781402045899

Physical Description:

XVIII, 331 p. 296 illus. online resource.

Series:

Springer Series in Advanced Microelectronics, 24

Series Title:

Springer Series in Advanced Microelectronics, 1437-0387 ; 24

Subject Term:

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Electronic Access:

Holds:
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Library	Material Type	Item Barcode	Shelf Number	Status	Item Holds
Searching... Online Library	E-Book	169225-2001	ONLINE	Searching... Unknown	Searching... Unavailable