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1. 
Cover image for Electromigration Modeling at Circuit Layout Level
Electromigration Modeling at Circuit Layout Level
Author 
Tan, Cher Ming. author. He, Feifei. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(336507.1)
Electronic Access 
http://dx.doi.org/10.1007/978-981-4451-21-5
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2. 
Cover image for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Author 
Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-310-7
Format: 
Availability 
Online Library~1
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