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1. 
Cover image for Defect-Oriented Testing for Nano-Metric CMOS VLSI Circuits 2nd Edition
Defect-Oriented Testing for Nano-Metric CMOS VLSI Circuits 2nd Edition
Author 
Sachdev, Manoj. editor. Gyvez, José Pineda de. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-46547-2
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2. 
Cover image for Micromanufacturing International Research and Development
Micromanufacturing International Research and Development
Author 
Ehmann, Kornel F. author. Bourell, David. author. Culpepper, Martin L. author. Hodgson, Thom J. author. Kurfess, Thomas R. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4020-5949-0
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3. 
Cover image for Power-Aware Architecting for data-dominated applications
Power-Aware Architecting for data-dominated applications
Author 
Ditzel, Maarten. author. Otten, Ralph H. J. M. author. Serdijn, Wouter A. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4020-6420-3
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4. 
Cover image for Design of Systems on a Chip: Design and Test
Design of Systems on a Chip: Design and Test
Author 
Reis, Ricardo. editor. Lubaszewski, Marcelo. editor. Jess, Jochen A.G. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32500-X
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5. 
Cover image for Integrated Circuit Packaging, Assembly and Interconnections
Integrated Circuit Packaging, Assembly and Interconnections
Author 
Greig, William J. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-33913-2
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6. 
Cover image for Compiling Esterel
Compiling Esterel
Author 
Potop-Butucaru, Dumitru. author. Edwards, Stephen A. author. Berry, Gérard. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-70628-3
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7. 
Cover image for Optimal Production Planning for PCB Assembly
Optimal Production Planning for PCB Assembly
Author 
Ho, William. author. Ji, Ping. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-84628-500-4
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8. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
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9. 
Cover image for Analog Design Centering and Sizing
Analog Design Centering and Sizing
Author 
Graeb, Helmut E. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4020-6004-5
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