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1. 
Cover image for The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author 
Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-236-0
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2. 
Cover image for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Author 
Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-310-7
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3. 
Cover image for Reliability of Microtechnology Interconnects, Devices and Systems
Reliability of Microtechnology Interconnects, Devices and Systems
Author 
Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5760-3
Format: 
Availability 
Online Library~1
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