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1. 
Cover image for Lead Free Solder Mechanics and Reliability
Lead Free Solder Mechanics and Reliability
Author 
Pang, John Hock Lye. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-0463-7
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2. 
Cover image for Magnetoelectric Response in Low-Dimensional Frustrated Spin Systems
Magnetoelectric Response in Low-Dimensional Frustrated Spin Systems
Author 
Seki, Shinichiro. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-4-431-54091-5
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3. 
Cover image for Microstructure and Properties of High-Temperature Superconductors
Microstructure and Properties of High-Temperature Superconductors
Author 
Parinov, I. A. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-34441-1
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4. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications
Molecular Modeling and Multiscaling Issues for Electronic Material Applications
Author 
Iwamoto, Nancy. editor. Yuen, Matthew M.F. editor. Fan, Haibo. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1728-6
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5. 
Cover image for Femtosecond Laser Micromachining Photonic and Microfluidic Devices in Transparent Materials
Femtosecond Laser Micromachining Photonic and Microfluidic Devices in Transparent Materials
Author 
Osellame, Roberto. editor. Cerullo, Giulio. editor. Ramponi, Roberta. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-23366-1
Format: 
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