Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Title:
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author:
Seok, Seonho. author.
ISBN:
9783319778723
Edition:
1st ed. 2018.
Physical Description:
VIII, 115 p. 106 illus. online resource.
Series:
Springer Series in Advanced Manufacturing,
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