Cover image for Through-silicon vias for 3D integration
Title:
Through-silicon vias for 3D integration
Author:
Lau, John.
ISBN:
9780071785150
Publication Information:
New York : McGraw Hill Professional, [2012]
Physical Description:
1 electronic text (xxiv, 487 p. : ill. (some col.)) : PDF file.
Series:
McGraw Hill ebook library. Engineering and computing, Electrical and electronics
Series Title:
McGraw Hill ebook library. Engineering and computing, Electrical and electronics
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