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13. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330808.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5768-9
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14. 
Cover image for Solid State Lighting Reliability Components to Systems
Solid State Lighting Reliability Components to Systems
Author 
van Driel, W.D. editor. Fan, X.J. editor. SpringerLink (Online service)
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ONLINE(331314.1)
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http://dx.doi.org/10.1007/978-1-4614-3067-4
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15. 
Cover image for Piezoresistor Design and Applications
Piezoresistor Design and Applications
Author 
Doll, Joseph C. author. Pruitt, Beth L. author. SpringerLink (Online service)
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ONLINE(332425.1)
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http://dx.doi.org/10.1007/978-1-4614-8517-9
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16. 
Cover image for Introduction to Thin Film Transistors Physics and Technology of TFTs
Introduction to Thin Film Transistors Physics and Technology of TFTs
Author 
Brotherton, S.D. author. SpringerLink (Online service)
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ONLINE(332657.1)
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http://dx.doi.org/10.1007/978-3-319-00002-2
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17. 
Cover image for Sensors An Introductory Course
Sensors An Introductory Course
Author 
Kalantar-zadeh, Kourosh. author. SpringerLink (Online service)
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ONLINE(331661.1)
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http://dx.doi.org/10.1007/978-1-4614-5052-8
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18. 
Cover image for Fundamentals of Nanoscaled Field Effect Transistors
Fundamentals of Nanoscaled Field Effect Transistors
Author 
Chaudhry, Amit. author. SpringerLink (Online service)
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ONLINE(332128.1)
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http://dx.doi.org/10.1007/978-1-4614-6822-6
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19. 
Cover image for High Permittivity Gate Dielectric Materials
High Permittivity Gate Dielectric Materials
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Kar, Samares. editor. SpringerLink (Online service)
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ONLINE(334228.1)
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http://dx.doi.org/10.1007/978-3-642-36535-5
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20. 
Cover image for Piezotronics and Piezo-Phototronics
Piezotronics and Piezo-Phototronics
Author 
Wang, Zhong Lin. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-642-34237-0
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21. 
Cover image for Lead Free Solder Mechanics and Reliability
Lead Free Solder Mechanics and Reliability
Author 
Pang, John Hock Lye. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-0463-7
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22. 
Cover image for Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Author 
He, Ming. author. Lu, Toh-Ming. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-1812-2
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23. 
Cover image for Semiconductor Modeling Techniques
Semiconductor Modeling Techniques
Author 
Balkan, Naci. editor. Xavier, Marie. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-27512-8
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24. 
Cover image for Deterministic Solvers for the Boltzmann Transport Equation
Deterministic Solvers for the Boltzmann Transport Equation
Author 
Hong, Sung-Min. author. Pham, Anh-Tuan. author. Jungemann, Christoph. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-7091-0778-2
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