Solder Joint Reliability Prediction for Multiple Environments
by
 
Perkins, Andrew E. author.

Title
: 
Solder Joint Reliability Prediction for Multiple Environments

Author
: 
Perkins, Andrew E. author.

ISBN
: 
9780387793948

Physical Description
: 
XVI, 192p. 70 illus. online resource.

Subject Term
: 
Engineering.
 
System safety.
 
Electronics.
 
Optical materials.
 
Materials.

Added Author
: 
Sitaraman, Suresh K.

Added Corporate Author
: 
SpringerLink (Online service)

Electronic Access
: 
http://dx.doi.org/10.1007/978-0-387-79394-8


LibraryMaterial TypeItem BarcodeShelf Number[[missing key: search.ChildField.HOLDING]]Status
Online LibraryE-Book167673-2001ONLINEElektronik Kütüphane