Bonding in Microsystem Technology
by
 
Dziuban, Jan A. author.

Title
: 
Bonding in Microsystem Technology

Author
: 
Dziuban, Jan A. author.

ISBN
: 
9781402045899

Physical Description
: 
XVIII, 331 p. 296 illus. online resource.

Series
: 
Springer Series in Advanced Microelectronics, 24

Series Title
: 
Springer Series in Advanced Microelectronics, 1437-0387 ; 24

Subject Term
: 
Engineering.
 
Materials.
 
Structural control (Engineering).
 
Electronics.
 
Optical materials.

Added Corporate Author
: 
SpringerLink (Online service)

Electronic Access
: 
http://dx.doi.org/10.1007/1-4020-4589-1


LibraryMaterial TypeItem BarcodeShelf Number[[missing key: search.ChildField.HOLDING]]Status
Online LibraryE-Book169225-2001ONLINEElektronik Kütüphane