Bonding in Microsystem Technology
by
Dziuban, Jan A. author.
Title
:
Bonding in Microsystem Technology
Author
:
Dziuban, Jan A. author.
ISBN
:
9781402045899
Physical Description
:
XVIII, 331 p. 296 illus. online resource.
Series
:
Springer Series in Advanced Microelectronics, 24
Series Title
:
Springer Series in Advanced Microelectronics, 1437-0387 ; 24
Subject Term
:
Engineering.
Materials.
Structural control (Engineering).
Electronics.
Optical materials.
Added Corporate Author
:
SpringerLink (Online service)
Electronic Access
:
Library | Material Type | Item Barcode | Shelf Number | [[missing key: search.ChildField.HOLDING]] | Status |
---|
Online Library | E-Book | 169225-2001 | ONLINE | | Elektronik Kütüphane |