Lead Free Solder Mechanics and Reliability
by
 
Pang, John Hock Lye. author.

Title
: 
Lead Free Solder Mechanics and Reliability

Author
: 
Pang, John Hock Lye. author.

ISBN
: 
9781461404637

Physical Description
: 
X, 175p. 162 illus. online resource.

Subject Term
: 
Engineering.
 
Materials.
 
Electronics.
 
Systems engineering.
 
Optical materials.

Added Corporate Author
: 
SpringerLink (Online service)

Electronic Access
: 
http://dx.doi.org/10.1007/978-1-4614-0463-7


LibraryMaterial TypeItem BarcodeShelf Number[[missing key: search.ChildField.HOLDING]]Status
Online LibraryE-Book173692-2001ONLINEElektronik Kütüphane