Lead Free Solder Mechanics and Reliability
by
Pang, John Hock Lye. author.
Title
:
Lead Free Solder Mechanics and Reliability
Author
:
Pang, John Hock Lye. author.
ISBN
:
9781461404637
Physical Description
:
X, 175p. 162 illus. online resource.
Subject Term
:
Engineering.
Materials.
Electronics.
Systems engineering.
Optical materials.
Added Corporate Author
:
SpringerLink (Online service)
Electronic Access
:
Library | Material Type | Item Barcode | Shelf Number | [[missing key: search.ChildField.HOLDING]] | Status |
---|
Online Library | E-Book | 173692-2001 | ONLINE | | Elektronik Kütüphane |