Materials for Information Technology Devices, Interconnects and Packaging
by
 
Zschech, Ehrenfried. editor.

Title
: 
Materials for Information Technology Devices, Interconnects and Packaging

Author
: 
Zschech, Ehrenfried. editor.

ISBN
: 
9781846282355

Physical Description
: 
XIX, 508 p. 338 illus. online resource.

Series
: 
Engineering Materials and Processes,

Series Title
: 
Engineering Materials and Processes, 1619-0181

Subject Term
: 
Engineering.
 
Particles (Nuclear physics).
 
Electronics.
 
Materials.
 
Surfaces (Physics).

Added Author
: 
Whelan, Caroline.
 
Mikolajick, Thomas.

Added Corporate Author
: 
SpringerLink (Online service)

Electronic Access
: 
http://dx.doi.org/10.1007/1-84628-235-7


LibraryMaterial TypeItem BarcodeShelf Number[[missing key: search.ChildField.HOLDING]]Status
Online LibraryE-Book175333-2001ONLINEElektronik Kütüphane