Materials for Information Technology Devices, Interconnects and Packaging
by
Zschech, Ehrenfried. editor.
Title
:
Materials for Information Technology Devices, Interconnects and Packaging
Author
:
Zschech, Ehrenfried. editor.
ISBN
:
9781846282355
Physical Description
:
XIX, 508 p. 338 illus. online resource.
Series
:
Engineering Materials and Processes,
Series Title
:
Engineering Materials and Processes, 1619-0181
Subject Term
:
Engineering.
Particles (Nuclear physics).
Electronics.
Materials.
Surfaces (Physics).
Added Author
:
Whelan, Caroline.
Mikolajick, Thomas.
Added Corporate Author
:
SpringerLink (Online service)
Electronic Access
:
Library | Material Type | Item Barcode | Shelf Number | [[missing key: search.ChildField.HOLDING]] | Status |
---|
Online Library | E-Book | 175333-2001 | ONLINE | | Elektronik Kütüphane |