Silicon Wafer Bonding Technology for VLSI and MEMS Applications
by
Iyer, S. S., ed.
Title
:
Silicon Wafer Bonding Technology for VLSI and MEMS Applications
Author
:
Iyer, S. S., ed.
ISBN
:
9781849193702
Publication Information
:
Stevenage : IET, 2002.
Physical Description
:
1 online resource (175 p.)
Series
:
Circuits, Devices and Systems
Series Title
:
Circuits, Devices and Systems
Subject Term
:
Bonding.
Electric resistance.
Grinding and polishing.
Integrated circuits--Very large scale integration.
Micromechanics.
Semiconductor wafers.
Silicon.
Silicon-on-insulator technology.
Added Author
:
Iyer, S. S.,
Auberton-Herv�, A. J.,
Electronic Access
:
| Library | Material Type | Item Barcode | Shelf Number | [[missing key: search.ChildField.HOLDING]] | Status |
|---|
| Online Library | E-Book | 247777-1001 | ONLINE | | Elektronik Kütüphane |