Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
by
Li, Er-Ping.
Title
:
Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author
:
Li, Er-Ping.
ISBN
:
9781118166727
9780470623466
Publication Information
:
[United States] : IEEE Press ; Hoboken : Wiley, c2012.
Physical Description
:
1 online resource.
Subject Term
:
Three-dimensional integrated circuits.
Genre
:
Electronic books.
Added Corporate Author
:
Wiley InterScience (Online service)
Electronic Access
:
Library | Material Type | Item Barcode | Shelf Number | [[missing key: search.ChildField.HOLDING]] | Status |
---|
Online Library | E-Book | 249361-1001 | ONLINE | | Elektronik Kütüphane |