Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
by
 
Li, Er-Ping.

Title
: 
Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC

Author
: 
Li, Er-Ping.

ISBN
: 
9781118166727
 
9780470623466

Publication Information
: 
[United States] : IEEE Press ; Hoboken : Wiley, c2012.

Physical Description
: 
1 online resource.

Subject Term
: 
Three-dimensional integrated circuits.

Genre
: 
Electronic books.

Added Corporate Author
: 
Wiley InterScience (Online service)

Electronic Access
: 
IEEEXplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551


LibraryMaterial TypeItem BarcodeShelf Number[[missing key: search.ChildField.HOLDING]]Status
Online LibraryE-Book249361-1001ONLINEElektronik Kütüphane