Reflow soldering processes SMT, BGA, CSP and flip chip technologies
by
 
Lee, Ning-Cheng.

Title
: 
Reflow soldering processes SMT, BGA, CSP and flip chip technologies

Author
: 
Lee, Ning-Cheng.

ISBN
: 
9780080492247

Publication Information
: 
Boston : Newnes, c2002.

Physical Description
: 
1 online resource (ix, 270 p.) : ill.

Subject Term
: 
Electronic apparatus and appliances -- Design and construction.
 
Solder and soldering.
 
Electronic packaging.
 
Electric connectors.

Electronic Access
: 
Volltext http://www.sciencedirect.com/science/book/9780750672184


LibraryMaterial TypeItem BarcodeShelf Number[[missing key: search.ChildField.HOLDING]]Status
Online LibraryE-Book256308-1001ONLINEElektronik Kütüphane