Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
by
 
Li, Er-Ping.

Title
: 
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC

Author
: 
Li, Er-Ping.

ISBN
: 
9780470623466

Publication Information
: 
Hoboken, N.J. : Wiley-IEEE Press, c2012.

Physical Description
: 
xiv, 366 p. : ill. (some col.) ; 26 cm.

Subject Term
: 
Three-dimensional integrated circuits.


LibraryMaterial TypeItem BarcodeShelf Number[[missing key: search.ChildField.HOLDING]]Status
Beytepe LibraryBook7.2/14/2658TK7874.893 L53 2012Beytepe Genel Koleksiyon