Through-silicon vias for 3D integration
by
 
Lau, John.

Title
: 
Through-silicon vias for 3D integration

Author
: 
Lau, John.

ISBN
: 
9780071785150

Publication Information
: 
New York : McGraw Hill Professional, [2012]

Physical Description
: 
1 electronic text (xxiv, 487 p. : ill. (some col.)) : PDF file.

Series
: 
McGraw Hill ebook library. Engineering and computing, Electrical and electronics

Series Title
: 
McGraw Hill ebook library. Engineering and computing, Electrical and electronics

Subject Term
: 
Three-dimensional integrated circuits.
 
Three-dimensional integrated circuits -- Design and construction.
 
Integrated circuits -- Design and construction.
 
Semiconductors -- Design and construction.
 
Semiconductor wafers.
 
Three-dimensional imaging.

Electronic Access
: 
Subscription required


LibraryMaterial TypeItem BarcodeShelf Number[[missing key: search.ChildField.HOLDING]]Status
Online LibraryE-Book293478-1001ONLINEElektronik Kütüphane