3D IC stacking technology
by
 
Wu, Banqiu.

Title
: 
3D IC stacking technology

Author
: 
Wu, Banqiu.

ISBN
: 
9780071741965

Publication Information
: 
New York : McGraw Hill Professional, 2011.

Physical Description
: 
1 electronic text (xviii, 521 p. : ill.) : PDF file.

Series
: 
McGraw Hill ebook library. Engineering and computing. Electrical and electronic

Series Title
: 
McGraw Hill ebook library. Engineering and computing. Electrical and electronic

Subject Term
: 
Three-dimensional integrated circuits.
 
Three-dimensional integrated circuits -- Design and construction.
 
Microelectronic packaging.
 
Semiconductors -- Design and construction.
 
Electronic apparatus and appliances -- Design and construction.
 
Multichip modules (Microelectronics)
 
Three-dimensional integrated circuits -- Computer-aided design.
 
Three-dimensional integrated circuits -- Testing.
 
Integrated circuits industry.

Added Author
: 
Wu, Banqiu.
 
Kumar, Ajay.
 
Ramaswami, Sesh.

Electronic Access
: 
Subscription required


LibraryMaterial TypeItem BarcodeShelf Number[[missing key: search.ChildField.HOLDING]]Status
Online LibraryE-Book293493-1001ONLINEElektronik Kütüphane