3D IC stacking technology
by
Wu, Banqiu.
Title
:
3D IC stacking technology
Author
:
Wu, Banqiu.
ISBN
:
9780071741965
Publication Information
:
New York : McGraw Hill Professional, 2011.
Physical Description
:
1 electronic text (xviii, 521 p. : ill.) : PDF file.
Series
:
McGraw Hill ebook library. Engineering and computing. Electrical and electronic
Series Title
:
McGraw Hill ebook library. Engineering and computing. Electrical and electronic
Subject Term
:
Three-dimensional integrated circuits.
Three-dimensional integrated circuits -- Design and construction.
Microelectronic packaging.
Semiconductors -- Design and construction.
Electronic apparatus and appliances -- Design and construction.
Multichip modules (Microelectronics)
Three-dimensional integrated circuits -- Computer-aided design.
Three-dimensional integrated circuits -- Testing.
Integrated circuits industry.
Added Author
:
Wu, Banqiu.
Kumar, Ajay.
Ramaswami, Sesh.
Electronic Access
:
Library | Material Type | Item Barcode | Shelf Number | [[missing key: search.ChildField.HOLDING]] | Status |
---|
Online Library | E-Book | 293493-1001 | ONLINE | | Elektronik Kütüphane |