Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing
by
 
Liu, S. (Sheng), 1963-

Title
: 
Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing

Author
: 
Liu, S. (Sheng), 1963-

ISBN
: 
9780470827826

Publication Information
: 
Hoboken, N.J. : Wiley, 2011.

Physical Description
: 
1 online resource (xxi, 564 p.) : ill. (some col.)

Subject Term
: 
Microelectronic packaging -- Simulation methods.

Added Author
: 
Liu, Yong, 1962-

Added Corporate Author
: 
Wiley InterScience (Online service)

Electronic Access
: 
Wiley InterScience An electronic book accessible through the World Wide Web; click for information


LibraryMaterial TypeItem BarcodeShelf Number[[missing key: search.ChildField.HOLDING]]Status
Online LibraryE-Book298653-1001ONLINEElektronik Kütüphane