Advanced Flip Chip Packaging
by
Tong, Ho-Ming. editor.
Title
:
Advanced Flip Chip Packaging
Author
:
Tong, Ho-Ming. editor.
ISBN
:
9781441957689
Physical Description
:
VII, 560 p. 413 illus., 242 illus. in color. online resource.
Subject Term
:
Engineering.
Electronics.
Systems engineering.
Optical materials.
Electronics and Microelectronics, Instrumentation.
Circuits and Systems.
Optical and Electronic Materials.
Added Author
:
Lai, Yi-Shao.
Wong, C.P.
Added Corporate Author
:
SpringerLink (Online service)
Electronic Access
:
Library | Material Type | Item Barcode | Shelf Number | [[missing key: search.ChildField.HOLDING]] | Status |
---|
Online Library | E-Book | 330808-1001 | ONLINE(330808.1) | | Elektronik Kütüphane |