Advanced Flip Chip Packaging
by
 
Tong, Ho-Ming. editor.

Title
: 
Advanced Flip Chip Packaging

Author
: 
Tong, Ho-Ming. editor.

ISBN
: 
9781441957689

Physical Description
: 
VII, 560 p. 413 illus., 242 illus. in color. online resource.

Subject Term
: 
Engineering.
 
Electronics.
 
Systems engineering.
 
Optical materials.
 
Electronics and Microelectronics, Instrumentation.
 
Circuits and Systems.
 
Optical and Electronic Materials.

Added Author
: 
Lai, Yi-Shao.
 
Wong, C.P.

Added Corporate Author
: 
SpringerLink (Online service)

Electronic Access
: 
http://dx.doi.org/10.1007/978-1-4419-5768-9


LibraryMaterial TypeItem BarcodeShelf Number[[missing key: search.ChildField.HOLDING]]Status
Online LibraryE-Book330808-1001ONLINE(330808.1)Elektronik Kütüphane