Designing TSVs for 3D Integrated Circuits
by
Khan, Nauman. author.
Title
:
Designing TSVs for 3D Integrated Circuits
Author
:
Khan, Nauman. author.
ISBN
:
9781461455080
Physical Description
:
X, 76 p. 34 illus., 29 illus. in color. online resource.
Series
:
SpringerBriefs in Electrical and Computer Engineering,
Subject Term
:
Engineering.
Computer science.
Electronics.
Systems engineering.
Circuits and Systems.
Processor Architectures.
Electronics and Microelectronics, Instrumentation.
Added Author
:
Hassoun, Soha.
Added Corporate Author
:
SpringerLink (Online service)
Electronic Access
:
Library | Material Type | Item Barcode | Shelf Number | [[missing key: search.ChildField.HOLDING]] | Status |
---|
Online Library | E-Book | 331791-1001 | ONLINE(331791.1) | | Elektronik Kütüphane |