Designing TSVs for 3D Integrated Circuits
by
 
Khan, Nauman. author.

Title
: 
Designing TSVs for 3D Integrated Circuits

Author
: 
Khan, Nauman. author.

ISBN
: 
9781461455080

Physical Description
: 
X, 76 p. 34 illus., 29 illus. in color. online resource.

Series
: 
SpringerBriefs in Electrical and Computer Engineering,

Subject Term
: 
Engineering.
 
Computer science.
 
Electronics.
 
Systems engineering.
 
Circuits and Systems.
 
Processor Architectures.
 
Electronics and Microelectronics, Instrumentation.

Added Author
: 
Hassoun, Soha.

Added Corporate Author
: 
SpringerLink (Online service)

Electronic Access
: 
http://dx.doi.org/10.1007/978-1-4614-5508-0


LibraryMaterial TypeItem BarcodeShelf Number[[missing key: search.ChildField.HOLDING]]Status
Online LibraryE-Book331791-1001ONLINE(331791.1)Elektronik Kütüphane