Fan-Out Wafer-Level Packaging
by
 
Lau, John H. author.

Title
: 
Fan-Out Wafer-Level Packaging

Author
: 
Lau, John H. author.

ISBN
: 
9789811088841

Edition
: 
1st ed. 2018.

Physical Description
: 
XX, 303 p. 278 illus., 226 illus. in color. online resource.

Subject Term
: 
Systems engineering.
 
Engineering.
 
Optical materials.

Added Corporate Author
: 
SpringerLink (Online service)

Electronic Access
: 
https://doi.org/10.1007/978-981-10-8884-1


LibraryMaterial TypeItem BarcodeShelf Number[[missing key: search.ChildField.HOLDING]]Status
Online LibraryE-Book399728-1001ONLINEElektronik Kütüphane