Fan-Out Wafer-Level Packaging
by
Lau, John H. author.
Title
:
Fan-Out Wafer-Level Packaging
Author
:
Lau, John H. author.
ISBN
:
9789811088841
Edition
:
1st ed. 2018.
Physical Description
:
XX, 303 p. 278 illus., 226 illus. in color. online resource.
Subject Term
:
Systems engineering.
Engineering.
Optical materials.
Added Corporate Author
:
SpringerLink (Online service)
Electronic Access
:
Library | Material Type | Item Barcode | Shelf Number | [[missing key: search.ChildField.HOLDING]] | Status |
---|
Online Library | E-Book | 399728-1001 | ONLINE | | Elektronik Kütüphane |