Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
by
Seok, Seonho. author.
Title
:
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author
:
Seok, Seonho. author.
ISBN
:
9783319778723
Edition
:
1st ed. 2018.
Physical Description
:
VIII, 115 p. 106 illus. online resource.
Series
:
Springer Series in Advanced Manufacturing,
Subject Term
:
Manufactures.
Nanotechnology.
Engineering.
Surfaces (Physics).
Chemistry, inorganic.
Added Corporate Author
:
SpringerLink (Online service)
Electronic Access
:
| Library | Material Type | Item Barcode | Shelf Number | [[missing key: search.ChildField.HOLDING]] | Status |
|---|
| Online Library | E-Book | 400941-1001 | ONLINE | | Elektronik Kütüphane |