Modeling and Application of Flexible Electronics Packaging
by
Huang, YongAn. author.
Title
:
Modeling and Application of Flexible Electronics Packaging
Author
:
Huang, YongAn. author.
ISBN
:
9789811336270
Edition
:
1st ed. 2019.
Physical Description
:
XVII, 287 p. online resource.
Subject Term
:
Electronics.
Microelectronics.
Optical materials.
Manufactures.
Mechanics.
Mechanics, Applied.
Computer simulation.
Added Author
:
Yin, Zhouping.
Wan, Xiaodong.
Added Corporate Author
:
SpringerLink (Online service)
Electronic Access
:
Library | Material Type | Item Barcode | Shelf Number | [[missing key: search.ChildField.HOLDING]] | Status |
---|
Online Library | E-Book | 484436-1001 | ONLINE | | Elektronik Kütüphane |