Modeling and Application of Flexible Electronics Packaging
by
 
Huang, YongAn. author.

Title
: 
Modeling and Application of Flexible Electronics Packaging

Author
: 
Huang, YongAn. author.

ISBN
: 
9789811336270

Edition
: 
1st ed. 2019.

Physical Description
: 
XVII, 287 p. online resource.

Subject Term
: 
Electronics.
 
Microelectronics.
 
Optical materials.
 
Manufactures.
 
Mechanics.
 
Mechanics, Applied.
 
Computer simulation.

Added Author
: 
Yin, Zhouping.
 
Wan, Xiaodong.

Added Corporate Author
: 
SpringerLink (Online service)

Electronic Access
: 
https://doi.org/10.1007/978-981-13-3627-0


LibraryMaterial TypeItem BarcodeShelf Number[[missing key: search.ChildField.HOLDING]]Status
Online LibraryE-Book484436-1001ONLINEElektronik Kütüphane