Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
by
Noia, Brandon. author.
Title
:
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Author
:
Noia, Brandon. author.
ISBN
:
9783319023786
Edition
:
1st ed. 2014.
Physical Description
:
XVIII, 245 p. 133 illus., 115 illus. in color. online resource.
Subject Term
:
Electronic circuits.
Microprocessors.
Semiconductors.
Added Author
:
Chakrabarty, Krishnendu.
Added Corporate Author
:
SpringerLink (Online service)
Electronic Access
:
Library | Material Type | Item Barcode | Shelf Number | [[missing key: search.ChildField.HOLDING]] | Status |
---|
Online Library | E-Book | 487405-1001 | ONLINE | | Elektronik Kütüphane |