Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
by
 
Noia, Brandon. author.

Title
: 
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Author
: 
Noia, Brandon. author.

ISBN
: 
9783319023786

Edition
: 
1st ed. 2014.

Physical Description
: 
XVIII, 245 p. 133 illus., 115 illus. in color. online resource.

Subject Term
: 
Electronic circuits.
 
Microprocessors.
 
Semiconductors.

Added Author
: 
Chakrabarty, Krishnendu.

Added Corporate Author
: 
SpringerLink (Online service)

Electronic Access
: 
https://doi.org/10.1007/978-3-319-02378-6


LibraryMaterial TypeItem BarcodeShelf Number[[missing key: search.ChildField.HOLDING]]Status
Online LibraryE-Book487405-1001ONLINEElektronik Kütüphane