Interconnect Reliability in Advanced Memory Device Packaging
by
Gan, Chong Leong,. author.
Title
:
Interconnect Reliability in Advanced Memory Device Packaging
Author
:
Gan, Chong Leong,. author.
ISBN
:
9783031267086
Edition
:
1st ed. 2023.
Physical Description
:
XVIII, 210 p. 100 illus., 89 illus. in color. online resource.
Series
:
Springer Series in Reliability Engineering,
Contents
:
Chapter 1: Advanced Memory and Device Packaging -- Chapter 2: Wearout Reliability-based Characterization in Memory Packaging -- Chapter 3: Recycling of Noble Metals Used in Memory Packaging -- Chapter 4: Advanced Flip Chip Packaging -- Chapter 5: Second Level Interconnect Reliability of Low Temperature Solder Materials Used in Memory Modules and Solid-State Drives (SSD) -- Chapter 6: Specific Packaging Reliability Testing -- Chapter 7: Reliability Simulation and Modeling in Memory Packaging -- Chapter 8: Interconnects Reliability for Future Cryogenic Memory Applications.
Subject Term
:
Computers.
Electronic circuits.
Hardware Performance and Reliability.
Electronic Circuits and Systems.
Added Author
:
Huang, Chen-Yu,.
Added Corporate Author
:
SpringerLink (Online service)
Electronic Access
:
| Library | Material Type | Item Barcode | Shelf Number | [[missing key: search.ChildField.HOLDING]] | Status |
|---|
| Online Library | E-Book | 526838-1001 | ONLINE | | Elektronik Kütüphane |