Arbitrary Modeling of TSVs for 3D Integrated Circuits
by
Salah, Khaled. author.
Title
:
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Author
:
Salah, Khaled. author.
ISBN
:
9783319076119
Edition
:
1st ed. 2015.
Physical Description
:
IX, 179 p. 159 illus., 99 illus. in color. online resource.
Series
:
Analog Circuits and Signal Processing,
Contents
:
Introduction: Work around Moore's Law -- 3D/TSV Enabling Technologies -- TSV Modeling and Analysis -- TSV Verification -- TSV Macro-Modeling Framework -- TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications and TSV-Based Bandpass Filter -- Imperfection in TSV Modeling -- New Trends in TSV -- TSV Fabrication -- Conclusions.
Subject Term
:
Electronic circuits.
Electronics.
Microprocessors.
Computer architecture.
Electronic Circuits and Systems.
Electronics and Microelectronics, Instrumentation.
Processor Architectures.
Added Author
:
Ismail, Yehea.
El-Rouby, Alaa.
Added Corporate Author
:
SpringerLink (Online service)
Electronic Access
:
| Library | Material Type | Item Barcode | Shelf Number | [[missing key: search.ChildField.HOLDING]] | Status |
|---|
| Online Library | E-Book | 529725-1001 | ONLINE | | Elektronik Kütüphane |