Holistic Simulation of Geotechnical Installation Processes Numerical and Physical Modelling
by
 
Triantafyllidis, Th. editor.

Title
Holistic Simulation of Geotechnical Installation Processes Numerical and Physical Modelling

Author
Triantafyllidis, Th. editor.

ISBN
9783319181707

Edition
1st ed. 2015.

Physical Description
VIII, 250 p. 141 illus., 114 illus. in color. online resource.

Series
Lecture Notes in Applied and Computational Mechanics, 77

Contents
Effects of Soil Deposition on the Initial Stress State in Model Tests Experimental Results and FE Simulation -- Demonstrator Experiments on Significant Effects During Pile Installation -- On Soil Deformation and Stress Redistribution Around Pressed-in and Vibrated Displacement Pile Tips -- Modelling of Soil Structure Interaction by Applying a Hypoplastic Material Behaviour within Mortar Contact Formulation -- Vibro-Injection Pile Installation in Sand: Part I - Interpretation as Multi-Material Flow -- Vibro-Injection Pile Installation in Sand: Part II - Numerical and Experimental Investigation -- Numerical Modelling of the Effective-stress Evolution in Saturated Soilaround a Vibrating Pile Toe -- A Numerical Approach to the Solution of Dynamic Boundary Value Problems for Fluid-Saturated Solids -- Neohypoplasticity - Estimation of Small Strain Stiffness -- Improved Integration of High-cycle Accumulated Strain Using Hierarchicaland EAS Finite Elements -- Simulation of Soils under Rapid Cyclic Loading Conditions -- Experimental Strain Response-Envelopes of Granular Materials for Monotonous and Low-Cycle Loading Processes.

Subject Term
Engineering geology.
 
Geotechnical engineering.
 
Mechanics, Applied.
 
Solids.
 
Geoengineering.
 
Geotechnical Engineering and Applied Earth Sciences.
 
Solid Mechanics.

Added Author
Triantafyllidis, Th.

Added Corporate Author
SpringerLink (Online service)

Electronic Access
https://doi.org/10.1007/978-3-319-18170-7


LibraryMaterial TypeItem BarcodeShelf Number[[missing key: search.ChildField.HOLDING]]Status
Online LibraryE-Book530429-1001ONLINEElektronik Kütüphane