Ceramic interconnect technology handbook
by
Barlow, Fred D.
Title
:
Ceramic interconnect technology handbook
Author
:
Barlow, Fred D.
ISBN
:
9781420018967
Physical Description
:
1 online resource (441 pages)
Contents
:
chapter 1 Overview of Ceramic Interconnect Technolgy -- chapter 2 Electrical Design, Simulation, and Testing -- chapter 3 ThermoMechanical Design -- chapter 4 Ceramic Materials -- chapter 5 Screen Printing -- chapter 6 Multilayer Ceramics -- chapter 7 Photo-Defined and Photo-Imaged Films -- chapter 8 Copper Interconnects for Ceramic Substrates and Packages -- chapter 9 Integrated Passives in Ceramic Substrates.
Subject Term
:
Electronic ceramics.
Electronic packaging -- Materials.
Interconnects (Integrated circuit technology) -- Design and construction.
Added Author
:
Barlow, Fred D.
Elshabini, Aicha.
Electronic Access
:
| Library | Material Type | Item Barcode | Shelf Number | [[missing key: search.ChildField.HOLDING]] | Status |
|---|
| Online Library | E-Book | 539502-1001 | TK7871.15 .C4 C44 2007 | | CRC E-Books |