Introduction to microsystem packaging technology
by
Jin, Yufeng., author.
Title
:
Introduction to microsystem packaging technology
Author
:
Jin, Yufeng., author.
ISBN
:
9781315217086
9781351824286
9781439865972
Physical Description
:
1 online resource (xiii, 218 pages)
General Note
:
A CRC title.
Contents
:
ch. 1. Introduction -- ch. 2. Design technique for microsystems packaging and integration -- ch. 3. Substrate technology -- ch. 4. Interconnection technology -- ch. 5. Device-level packaging -- ch. 6. MEMS packaging -- ch. 7. Module assembly and optoelectronic packaging -- ch. 8. System-level packaging technology -- ch. 9. Reliability -- ch. 10. Prospects for microsystems packaging technology.
Subject Term
:
Microelectronic packaging.
Added Author
:
Wang, Zhiping, 1962- Oct. 6-
Chen, Jing, 1974-
Electronic Access
:
| Library | Material Type | Item Barcode | Shelf Number | [[missing key: search.ChildField.HOLDING]] | Status |
|---|
| Online Library | E-Book | 546454-1001 | TK7870.15 .J56 2011 | | CRC E-Books |