Thermal and structural electronic packaging analysis for space and extreme environments
by
 
Cepeda-Rizo, Juan, author.

Title
: 
Thermal and structural electronic packaging analysis for space and extreme environments

Author
: 
Cepeda-Rizo, Juan, author.

ISBN
: 
9781003247005
 
9781000511079
 
9781000511086

Edition
: 
First edition.

Physical Description
: 
1 online resource.

Series
: 
Resilience and sustainability in civil, mechanical, aerospace and manufacturing engineering systems

Subject Term
: 
Electronic packaging.
 
Electronic apparatus and appliances -- Reliability.
 
Space vehicles -- Electronic equipment -- Design and construction.
 
Extreme environments.
 
TECHNOLOGY / Engineering / Civil
 
TECHNOLOGY / Engineering / Mechanical

Added Author
: 
Gayle, Jeremiah,
 
Ravich, Joshua,

Electronic Access
: 
Taylor & Francis https://www.taylorfrancis.com/books/9781003247005
 
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf


LibraryMaterial TypeItem BarcodeShelf Number[[missing key: search.ChildField.HOLDING]]Status
Online LibraryE-Book579090-1001TK7870.15Taylor Fransic E-Kitap Koleksiyonu