Cover -- Title Page -- Copyright Page -- Contents -- Preface -- Introduction -- Part 1. Material Challenges and Novel Effects -- Chapter 1. Reliability and Durability of Thermoelectric Materials and Devices: Present Status and Strategies for Improvement -- 1.1. Introduction -- 1.2. Thermoelectric material stability -- 1.3. Mg3(Sb, Bi)2 -- 1.4. Zn4Sb3 -- 1.5. Skutterudites -- 1.6. Cu2-xX (X = S, Se, Te) -- 1.7. GeTe -- 1.8. Outlook on thermoelectric materials stability -- 1.9. Thermoelectric device design analysis -- 1.9.1. Thermal stress analysis -- 1.9.2. Interface analysis, design and fabrication -- 1.10. Advanced thermoelectric module case studies -- 1.10.1. Bi2Te3 -- 1.10.2. Mg3(Sb, Bi)2 -- 1.10.3. GeTe -- 1.10.4. Skutterudites -- 1.11. Summary and outlook -- 1.12. References -- Chapter 2. Effect of Microstructure in Understanding the Electronic Properties of Complex Materials -- 2.1. Introduction -- 2.2. Basic principles of electronic transport parameters -- 2.2.1. Solid solutions -- 2.2.2. Intrinsic defects -- 2.2.3. Grain boundary -- 2.2.4. Texture -- 2.3. Summary -- 2.4. References -- Chapter 3. Thermoelectric Nanowires -- 3.1. Introduction -- 3.2. Nanowires: a way to enhance thermoelectric efficiency -- 3.3. Fabrication of thermoelectric nanowires -- 3.4. Measurement of thermoelectric properties in nanowires -- 3.5. Nanowire-based thermoelectric devices -- 3.6. Interconnected 3D nanowire networks -- 3.7. Summary and outlook -- 3.8. References -- Chapter 4. Impact of Chemical Doping or Magnetism in Model Thermoelectric Sulfides -- 4.1. Introduction -- 4.2. TiS2: intercalation chemistry to combine power factor optimization and lattice thermal conductivity degradation -- 4.3. Magnetism and thermoelectricity in sulfides -- 4.4. Conclusion -- 4.5. References -- Chapter 5. Thermoelectric Generation Using the Anomalous Nernst Effect.

5.1. Thermoelectric conversion -- Seebeck effect and anomalous Nernst effect (ANE) -- 5.2. Physics of topological magnets -- 5.2.1. Transverse electrical and thermal conductivity driven by Berry curvature -- 5.2.2. Magnetic Weyl semimetals, Weyl magnets -- 5.2.3. Type-II Weyl semimetals -- 5.2.4. Nodal line magnets -- 5.3. Experimental realization of the giant anomalous Nernst effect -- 5.3.1. Weyl antiferromagnets Mn3X (X = Sn, Ge) -- 5.3.2. Weyl ferromagnet Co2MnGa -- 5.3.3. Nodal-web ferromagnets Fe3X (X = Ga, Al) -- 5.4. Summary and prospects -- 5.5. Acknowledgment -- 5.6. References -- Chapter 6. A Comprehensive Review of Phonon Engineering -- 6.1. Introduction -- 6.1.1. Thermal conductivity -- 6.1.2. Phonons in thermal transport -- 6.2. Methodology of phonon engineering -- 6.2.1. Computational method for thermal conduction and phonon properties -- 6.2.2. Experimental method for nano-/micro-scale heat conduction characterization -- 6.2.3. Direct measurement of phonon properties through phonon scattering -- 6.2.4. Phonon engineering for low thermal conductivity -- 6.2.5. Intrinsic low thermal conductivity in complex lattice structure -- 6.2.6. Low thermal conductivity by nanostructures -- 6.2.7. Coherent phonon engineering in superlattice -- 6.3. Summary and future prospects -- 6.4. References -- Part 2. Toward Device Applications -- Chapter 7. The Current State of Thermoelectric Technologies and Applications with Prospects -- 7.1. Introduction -- 7.2. Thermoelectric materials -- 7.3. Thermoelectric devices -- structure, materials, fabrication technology -- 7.4. Summary -- 7.5. References -- Chapter 8. Processing of Thermoelectric Transition Metal Silicides Towards Module Development -- 8.1. Introduction -- 8.2. Recent progress on the process of thermoelectric transition metals silicide.

8.2.1. Synthesis of mesostructured silicides through magnesiothermic reduction -- 8.2.2. Synthesis of higher manganese silicide through wet ball milling -- 8.2.3. Issues of MnSi striations and thermal stability on thermoelectric performance of doped higher manganese silicide -- 8.2.4. Upscaling processes, the examples of additive manufacturing and RGS process -- 8.3. Towards contacts and device developments -- 8.4. References -- Chapter 9. Application of the Thermoelectrics -- Past, Present and Future -- 9.1. Introduction -- 9.2. Thermoelectric module -- 9.3. TEC application for refrigerator and cooler -- 9.4. TEC for electronic components -- 9.4.1. TEC for optical communication -- 9.4.2. Multi-stage TEC for optical sensors -- 9.5. TEC for semiconductor manufacturing -- 9.6. TEG application -- 9.6.1. TEG for energy harvesting (EH) -- 9.6.2. TEG for stand-alone power source -- 9.6.3. TEG for waste heat recovery -- 9.7. Conclusion -- 9.8. References -- List of Authors -- Index -- Summary of Volume 1 -- EULA.