Preface -- Chapter 1 On Analog Circuits -- 1.1 Introduction: miscellaneous -- 1.1.1 SPICE -- 1.1.2 Technologies: conception-aided design -- 1.1.3 Resistor technologies -- 1.2 A simple but realistic amplifier circuit: the bipolar junction transistor with a common emitter -- 1.2.1 Small signal equivalent schematic of common feedback emitter with base bridge -- 1.2.2 Current gain calculation -- 1.3 Integrated circuit design -- 1.4 Current sources -- 1.4.1 Simple current sources -- 1.4.2 Wildar current source -- 1.4.3 Wilson current source -- 1.4.4 Current source and voltage source -- 1.4.5 Advantages and disadvantages of both sources: one phase and Wildar -- 1.4.6 Cascode-connected current source -- 1.4.7 Single current source -- 1.4.8 Improved Wilson current source -- 1.5 A historic circuit: the 741 operational amplifier -- 1.5.1 Active charge -- 1.5.2 741 description -- 1.5.3 Continuous analysis -- 1.5.4 Analysis of 741 small signals -- 1.5.5 The third stage -- 1.5.6 Considering the effect of the second order: computer analysis -- 1.6 Electric simulator -- 1.6.1 Analysis of steady-state linear circuits -- 1.6.2 Transitional analysis -- 1.6.3 Nonlinear system: Newton-Raphson method -- 1.7 Simulation of a system with several active devices -- 1.8 Basic analog functional blocks in (C)MOS technology -- 1.8.1 Common source NMOS transistors -- 1.8.2 Reminder on the general structure of the operational amplifier -- 1.9 Conclusion -- Chapter 2 Noise and Interference in Mixed Circuits -- 2.1 Introduction -- 2.2 Ground or power supply noise and substrate coupling -- 2.2.1 Noise propagation in a silicon substrate -- 2.2.2 Simulation methodology -- 2.3 Noise in integrated oscillator circuits -- 2.3.1 Oscillator design considerations -- 2.3.2 VCO topography -- 2.3.3 Results and discussion -- 2.4 Sensitivity functions -- 2.5 New developments in impulse sensitivity function -- 2.5.1 Oscillators: brief recap of the theory -- 2.5.2 Pulse sensitivity function (with some recap) -- 2.5.3 Influence of digital blocks on analog blocks -- Chapter 3 From 2D to 3D: Opportunities and Challenges -- 3.1 Introduction -- 3.2 3D integration -- 3.2.1 3D impedance extraction -- 3.2.2 Model validation -- 3.2.3 Interconnections: compact models -- 3.2.4 Validation: test structures -- 3.2.5 Numerical simulations -- 3.2.6 Prospects and future directions -- 3.3 Conclusion -- References -- Index.