Search Results for Electronic packaging.

27 Results Found

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Advanced electronic packaging

Author

Brown, William D., 1943- Ulrich, Richard K. (Richard Kevin), 1955-

Preferred Shelf Number

ONLINE

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Advanced electronic packaging

Author

Ulrich, Richard K. (Richard Kevin), 1955- Brown, William D., 1943-

Preferred Shelf Number

ONLINE

Electronic Access

IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5769522

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The electronic packaging handbook

Author

Blackwell, Glenn R.

Preferred Shelf Number

ONLINE

Electronic Access

Distributed by publisher. Purchase or institutional license may be required for access.

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Nano-Bio- Electronic, Photonic and MEMS Packaging

Author

Wong, C.P. editor. Moon, Kyoung-Sik. editor. Li, Yi (Grace). editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1007/978-1-4419-0040-1

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Power Electronic Packaging Design, Assembly Process, Reliability and Modeling

Author

Liu, Yong. author. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1007/978-1-4614-1053-9

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Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging

Author

Gerlach, Gerald. editor. Wolter, Klaus-Jürgen. editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1007/978-3-642-28522-6

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Advanced Materials for Thermal Management of Electronic Packaging

Author

Tong, Xingcun Colin. author. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1007/978-1-4419-7759-5

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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Author

Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1007/0-387-32989-7

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Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging

Author

Suhir, Ephraim. Lee, Y. C. Wong, C. P.

Preferred Shelf Number

TK7874 .M438 2007 V.1

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10.

Contamination of electronic assemblies

Author

Pecht, Michael.

Preferred Shelf Number

TK7870.15 C66 2003

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11.

Electronic enclosures, housings and packages

Author

Süli, Frank, author.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect https://www.sciencedirect.com/science/book/9780081023914

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12.

Extreme environment electronics

Author

Cressler, John D. Mantooth, H. Alan, 1963-

Preferred Shelf Number

ONLINE

Electronic Access

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13.

Hermeticity of electronic packages

Author

Greenhouse, Hal. Lowry, Robert (Robert K.), 1944- Romenesko, Bruce.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9781437778779

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14.

MEMS/MOEMS packaging concepts, designs, materials, and processes

Author

Gilleo, Ken.

Preferred Shelf Number

ONLINE

Electronic Access

Subscription required

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15.

LED packaging for lighting applications design, manufacturing, and testing

Author

Liu, S. (Sheng), 1963- Luo, Xiaobing, 1974-

Preferred Shelf Number

ONLINE

Electronic Access

Click here to view book
John Wiley http://dx.doi.org/10.1002/9780470827857
http://site.ebrary.com/lib/alltitles/Doc?id=10490643

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16.

Practical guide to the packaging of electronics thermal and mechanical design and analysis

Author

Jamnia, Ali, 1961-

Preferred Shelf Number

ONLINE

Electronic Access

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17.

Ceramic interconnect technology handbook

Author

Barlow, Fred D. Elshabini, Aicha.

Preferred Shelf Number

ONLINE

Electronic Access

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18.

Adhesives technology for electronic applications materials, processes, reliability

Author

Licari, James J., 1930- Swanson, Dale W.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9780815515135

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19.

Handbook of lead-free solder technology for microelectronic assemblies

Author

Puttlitz, Karl J. Stalter, Kathleen A.

Preferred Shelf Number

ONLINE

Electronic Access

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20.

MEMS Packaging

Author

Tai-Ran Hsu, ed.

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBEP003E

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21.

Lead-free soldering in electronics science, technology and environmental impact

Author

Suganuma, Katsuaki.

Preferred Shelf Number

ONLINE

Electronic Access

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22.

Reflow soldering processes SMT, BGA, CSP and flip chip technologies

Author

Lee, Ning-Cheng.

Preferred Shelf Number

ONLINE

Electronic Access

Volltext http://www.sciencedirect.com/science/book/9780750672184

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23.

Thermal design of electronic equipment

Author

Remsburg, Ralph.

Preferred Shelf Number

ONLINE

Electronic Access

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24.

Run-to-run control in semiconductor manufacturing

Author

Moyne, James. Del Castillo, Enrique. Hurwitz, Arnon Max.

Preferred Shelf Number

ONLINE

Electronic Access

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25.

Hermeticity of electronic packages

Author

Greenhouse, Hal.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9780815514350

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26.

Electronic techniques : shop practices and construction

Author

Villanucci, Robert S., 1944- Avtgis, Alexander W. Megow, William F.

Preferred Shelf Number

TK7836 .V55 1996

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27.

Microwave Field-Effect Transistors Theory, design and applications

Author

Pengelly, Raymond S.

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/SBEW016E

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