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1. 
Cover image for Bonding theory
Bonding theory
Author 
Royer, Donald J.
Preferred Shelf Number 
QD 461 R66 1968
Format: 
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2. 
Cover image for Chemical bonding
Chemical bonding
Author 
Companion, Audrey L.
Preferred Shelf Number 
QD 461 C63 1964
Format: 
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3. 
Cover image for Metal-Metal Bonding
Metal-Metal Bonding
Author 
Parkin, Gerard. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-05243-9
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4. 
Cover image for Copper Wire Bonding
Copper Wire Bonding
Author 
Chauhan, Preeti S. author. Choubey, Anupam. author. Zhong, ZhaoWei. author. Pecht, Michael G. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-5761-9
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5. 
Cover image for Metal-ligand bonding
Metal-ligand bonding
Author 
Moore, E.A. Abel, Edward W. Janes, Rob. The Open University.
Preferred Shelf Number 
ONLINE(343977.1)
Electronic Access 
http://dx.doi.org/10.1039/9781847559456
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6. 
Cover image for Structure and bonding
Structure and bonding
Preferred Shelf Number 
ONLINE(343844.1)
Electronic Access 
http://dx.doi.org/10.1039/9781847551955
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7. 
Cover image for Handbook of wafer bonding
Handbook of wafer bonding
Author 
Ramm, Peter. Lu, James Jian-Qiang. Taklo, Maaike M. V.
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527644223
Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=822735
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8. 
Cover image for Electrons and chemical bonding
Electrons and chemical bonding
Author 
Gray, Harry B.
Preferred Shelf Number 
QD 461 G72 1964
Format: 
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9. 
Cover image for Handbook of adhesive bonding
Handbook of adhesive bonding
Author 
Cagle, Charles V. Lee, Henry, ed. Neville, Kris, ed.
Preferred Shelf Number 
TP 968 C32 1973
Format: 
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10. 
Cover image for Hydrogen Bonding—New Insights
Hydrogen Bonding—New Insights
Author 
Grabowski, Sławomir J. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4020-4853-1
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11. 
Cover image for Bonding in Microsystem Technology
Bonding in Microsystem Technology
Author 
Dziuban, Jan A. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-4020-4589-1
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12. 
Cover image for Molecular modelling and bonding
Molecular modelling and bonding
Author 
Moore, Elaine (Elaine A.) Open University.
Preferred Shelf Number 
ONLINE(312866.1)
Electronic Access 
Knovel http://app.knovel.com/web/toc.v/cid:kpMWMMB007
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