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Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-96-4166-6
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2. 
Cover image for Solid State Lighting Reliability Part 2 Components to Systems
Solid State Lighting Reliability Part 2 Components to Systems
Author 
van Driel, Willem Dirk. editor. Fan, Xuejun. editor. Zhang, Guo Qi. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-58175-0
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Online Library~1
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