Title:
Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing
Author:
Liu, S. (Sheng), 1963-
ISBN:
9780470827826
Publication Information:
Hoboken, N.J. : Wiley, 2011.
Physical Description:
1 online resource (xxi, 564 p.) : ill. (some col.)
Subject Term:
Added Author:
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Electronic Access:
Wiley InterScience An electronic book accessible through the World Wide Web; click for informationCopies:
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Library | Material Type | Item Barcode | Shelf Number | Status | Item Holds |
|---|---|---|---|---|---|
Searching... | E-Book | 298653-1001 | ONLINE | Searching... | Searching... |